Tasks and Responsibilities:

• Proactive process development of optoelectronic components with a focus on damage-free grinding and polishing of wafers
• Support of chip development projects from small-scale tests up to the introduction of the optimized processes into high-volume production
• Process improvements on existing production tools, including the evaluation and introduction of new processes, materials, and equipment - also in cooperation with equipment manufacturers
• Development of cost-effective, automated, and robust processes for high-volume production
• Qualification and characterization of the materials and process media

Qualifications

• Masters degree in material science, physics, chemistry, microsystems technology or comparable, PhD is an advantage
• Professional experience in an industrial environment, such as the semiconductor industry, advantageous
• Strong physical and chemical understanding of semiconductor processes (wafer processing) and knowledge of relevant analytical methods
• Knowledge of wafer thinning, CMP, tape processes or mechanical/chemical treatment of wafers is an advantage
• Excellent communication and team skills, analytical thinking, and creativity
• Very good knowledge of English and German (intermediate German is a minimum)
• Willingness for occasional travel