Package Development Engineer
- Job Title
- Package Development Engineer
- Job ID
- 27239922
- Location
- Graz,Austria, Styria
- Other Location
- Description
-
Our Austrian client, a leading worldwide supplier of high performance sensor solutions is in search of a:
Package Development Engineer
Your tasks and responsibilities
- Develop sensor packages for consumer or automotive applications as part of the product engineering team
- Coordinate package design (mechanical & optical design, simulations) and manufacturing (internal or at assembly partners)
- Specify, build and analyze engineering builds of new packages in terms of mechanical / functional / reliability performance
- Interface with IC design, quality, assembly, product management and application teams & represent package development in multi-disciplinary /multi-site product development teams
- Execute package development to successful completion within given resource constraints (time, budget)
- Continuously improve package technology to achieve time, quality and cost targets
- Support technology & supplier selection for new packages in collaboration with R&D, Operations & Quality
- Identify cost improvements
Your education and experiences
- University degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
- Professional experience in semiconductor packaging and/or optical engineering and/or microelectronics is a benefit but not a requirement
- CAD or optical / FEM simulation software skills are a benefit
- Strong analytical and problem solving skills
- Hands-on-mentality
- Ability to execute developments within time / budget constraints
- Ability to cope with high workloads in critical project stages
- Ability to work in & collaborate with diverse teams in multiple geographical locations
- Creativity and curiosity
- Willingness to travel (max. 10%
- Fluent English
- Required Skills
-
- University degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
- Proficiency in English
- Willingness to travel (max. 10%)
- Optional Skills
-
- Professional experience in semiconductor packaging and/or optical engineering and/or microelectronics is a benefit but not a requirement
- CAD or optical / FEM simulation software skills are a benefit
- Openings
- 1